specifications

mecapol p 400

• high capacity polishing machine.

• base plate ø 380 mm.

• almag plate ø 400 mm x 20 mm,

easily removable.

• variable speed 30 to 300 rpm.

• constant torque.

• progressive acceleration.

• 2 pre-se-lected speed 50/100 rpm.

• 2 direction rotation.

• power 750 watts.

• digital display of speeds.

• touch sensitive keys with

led indicators.

• frame protected against

rust corrosion.

• painted steel body.

• large proportional bowl, tilted

and removable.

• water inlet driven by sluice gate.

• multi spray water cooling.

• voltage 230 v., single phase

pe.re b

• polishing head with central pressure.

• digital display of time and pressure.

• low pressure loading and unloading.

• touch sensitive keys.

• adjustable sweep (position,

amplitude and velocity).

• tank for 150 ml of lubricant.

• adjustable and driven lubricant flow.

• consolidated spindle for intensive use.

• power 120 watts.

• variable speed 20 to 80 rpm.

• pneumatic pressure adjusted

electronically from 0,5 to 40 dan.

• direct reading of pressure.

• voltage 230 v., single phase.

operating

the mecapol p 400 can be used

to prepare substrates

of ø 2 to 6“.

• this machine has been

designed for standard polishing

as well as cpm applications.

• due to quick changing of its

wafer holder and its polishing

plate, this polishing machine is

very well adapted to development

and laboratories applications.

• as speed, load and time are

adjustable, all processes can be

achieved.